Introduction
Process control and full process characterization, which include process window analysis, are key to speeding up innovation cycle times efficiently. RAITH’s all-in-one approach provides full metrology and inspection capabilities in a single automated SEM for lab-to-fab environments. With its fully automated workflow and CAD-based navigation, our process control solutioncan acquire and evaluate 10,000 images in a fully automated way to identify process variations on a nanometer level with a high level of reproducibility.
Application
Metrology
With our process control solution we offer fully automated data acquisition and evaluation workflows on full wafer scale without any user influence. Typical parameters like CD (critical dimension), LER (line-edge roughness), LWR (line-width roughness), etc. can be automatically evaluated. While traditional SEM instruments are inherently limited by small, uncalibrated fields of view (FOVs) and imprecise sample positioning, the process control solution addresses these challenges by combining the resolution and flexibility of an SEM instrument with the accuracy, stability, and automation of an electron beam lithography (EBL) instrument – a core area of expertise at RAITH. The integrated laser interferometer stage and field-of-view correction minimizes stitching-overlap and concomitant computing. This enables the capture and combination of multiple images in a large-area image mosaic with highest stability, which leads to more accurate measurement results.
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