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An advanced fabrication techniques combing EBL and FIB can perfect integrated photonic circuits for cutting-edge applications. This application note explores precise post-fabrication tuning using RAITH's electron beam lithography and focused ion beam patterning. Learn how to correct fabrication imperfections with sub-picometer accuracy for optimized photonic devices, revolutionizing data interconnects, sensors, AI accelerators, and quantum technologies.

Algorithmic pattern preparation for metalens fabrication achieves high throughput, bypassing design layout conversion, ensuring precision.

EBPG is utilized to develop an on-chip approach with integrated optics for quantum computing, facilitating secure communication and the simulation of complex systems.

Modulated Beam Moving Stage (MBMS) technology enables the fabrication of periodic structures like distributed feedback (DFB) gratings and photonic crystal waveguides.

Fixed Beam Moving Stage (FBMS) exposure technology can be used to fabricate perfect stitching-error-free arrayed couplings and tapered waveguides up to several millimeters in length.

Many applications in photonics, optoelectronics, displays, biosensors, etc. involve covering large areas with periodic nanostructures. To complement serial EBL writings, this application note describes the combination of an electron beam lithography system and photolithography system to efficiently fabricate periodic nanostructures over large areas with high precision and high throughput.

High quality TEM lamellae are crucial for high-resolution TEM characterization. Using a vertical FIB column with multiple ion species for TEM sample prep yields many advantages. ThIs application note highlights how to use VELION’s unique features to advance the quality of TEM investigations and to optimize TEM lamella prep for a wider range of materials.

Transforming randomly distributed 1D and 2D material into functional devices with the help of SEM mapping and innovative offline data preparation for direct-write lithography.

For determination and control of material growth/etching rates or surface topography, an in-situ AFM inside a nanoengineering tool is the ideal complement to the 2D imaging capabilities of a Raith EBL tool. This application note shows how the integration of an AFM into an eLINE Plus adds 3D metrology to the nanoengineering system and exceeds the capability of traditional EBL tools in terms of e.g. 3D surface topography analysis for nanolithography on non-planar surfaces.

Efficient alternative to traditional methods for electrical characterization of nanowires, utilizing in-situ measurements for quicker and more effective results compared to typical probing stations.

Fresnel zone plates are widely used as diffractive-based focusing elements in X-ray microscopy, achieving resolutions down to 25 nm. While they are typically prepared by EBL, this application note shows how the fabrication of zone plates by a dedicated FIB nanofabrication system (RAITH ionLINE) is able to significantly reduce the fabrication steps while still deliver the necessary high resolution.

As compared to traditional nanopatterning methods like EBL or other e-beam based alternatives such as FEBID and ice lithography, the newly discovered method using “organic ice resist” (OIR) opens new possibilities for nanopatterning. The application note explains the advantages of negative-tone direct-write OIR processes which eliminate the solvent development and drying required for EBL, thus allowing for further sample processing either in situ or ex situ.

A standard adhesive tape can help overcome the relatively slow patterning speed of direct FIB milling. The Application Note explains the new sketch & peel approach in detail and also investigates the change in outcome when using different ion species. Learn how simple adhesive tape can help you increase your throughput up to several orders of magnitude compared to usual FIB milling.

Lean how to utilize RAITH’s nanoFIB column with its long-term stable ion beam current at lowest position drift and lowest beam tails to advance FIB nanofabrication to the level of a lithography system. The Whitepaper describes the state-of-the-art focused ion beam column technology and its key strengths to achieve cutting-edge application results.

Learn how to benefit from resistless FIB nanofabrication and how to get access to a wide range of applications which are beyond the reach of common FIB-SEM and EBL instruments. The Whitepaper highlights typical applications that can be addressed with VELION, such as 3D nanostructures at once over mm length, FIB hard masking of large area patterns and many more.

Learn how the unique IONselect technology gives you the chance to utilize light or heavy and swift or slow ions from universal ion sources. Immediate switching between different ions paves the ways for new lithography process pathways. The Whitepaper describes the innovative source technology of Raith’s nanoFIB column with IONselect and its availability of various ions for FIB nanofabrication.

Find out how to get high-resolution 2D and 3D images of your sample, utilizing light and heavy ions from the same source for ion microscopy. The Whitepaper describes the functionality and benefits of the multiple-ion-species FIB column in combination with a mature lithography platform to easily achieve precise 3D sample reconstruction.

The EKB was originally published by Wiley, Microscopy and Analysis

This article was originally published in Microscopy Today, Volume 24, Issue 05, September 2016, pp 28-33. Thanks to Microscopy Today and Cambridge University Press for permission to distribute this article.

Please note, this article is published in Applied Physics Reviews Open Access under the CC-BY license

This article first appeared in the March 2018 issue of Microscopy & Analysis magazine