Metalenses are transforming optical engineering — enabling ultra‑flat, compact, and high‑performance imaging systems for applications ranging from next‑generation smartphones to advanced AR/VR devices and bio‑diagnostic platforms. But scaling metalens fabrication remains a major challenge: billions of nano‑structures, tight placement tolerances, and the need for uncompromising line‑edge fidelity push traditional electron beam lithography (EBL) to its limits.

In this comprehensive application note, RAITH’s experts demonstrate how a novel algorithmic pattern generation approach overcomes these barriers and sets a new benchmark for metalens throughput and quality.

Discover how algorithmic GPF file creation eliminates the need for traditional GDSII fracturing — drastically reducing file size, avoiding CPU‑intensive processes, and maintaining full control over fracturing strategies.

Learn how RAITH's “smooth mode” and “spiral‑in mode” ensure ultra‑uniform beam‑shot distribution and exceptional line‑edge roughness (LER), even with varying nanofin rotation angles.

See how high beam currents (up to 80 nA) and optimized beam step sizes consistently deliver high‑resolution patterns — enabling a 10 mm metalens to be written in just 56 minutes.

The method allows you to easily modulate beam step sizes, focal lengths, wavelengths, and pattern diameters — with clear scaling relationships for file size and generation time (up to billions of nanofins).